KELTRON’s 58F, 16V Supercapacitor Bank Module provides energy storage and power delivery in a compact, cost-effective module. The product is specifically engineered to provide cost-effective solutions for wind turbine pitch control of 1.5MW and smaller, light-duty AGV power systems, small UPS systems, telecommunications and other lighter-duty industrial electronics applications. The product is based on 360F Supercapacitors made by KELTRON. In addition to meeting or exceeding demanding industrial application requirements for both watt-hours of energy storage and watts of power delivery per kilogram, this product will perform reliably for more than 500,000 discharge- recharge cycles. The modules can be series connected up to 750V and/or parallel connected for higher energy requirements. The easy-to-connect, standard module allows system designers to focus upon use of the power and energy, rather than on how to assemble cells.

 

The SuperCell 5816 integrates a total of six supercapacitors rated at 2.7V 360F connected in series to achieve the desired electrical characteristics of the module. This results in 58F, 16V Supercapacitor Bank packed in a compact and reliable cylindrical form factor, with outstanding electrical parameters and life performance. This Supercapacitor Bank, with 4-axial, through-hole snap-in terminals is board mountable to achieve reliable and robust electrical and mechanical connectivity which maintains its integrity in high vibration applications also.

To provide an equal voltage distribution amongst all six internal Supercapacitors, the product features an integrated passive balancing circuitry. Sized to accommodate the slight tolerance in capacitance and leakage current of each individual Supercapacitor in the design, the integrated passive balancing circuit ensures that each cell will operate within its normal operating conditions and therefore ensure the longest lifetime of the product.

The product offers two power terminals (one positive, one negative) and also six mounting points for securing the module in any application.

The product packaging is a rigid enclosure rated for the following stress and environmental conditions: